PRODUCTION IS EQUIPPED WITH MODERN TECHNOLOGIES
Installation of any complexity
Production facilities are represented by modern high-tech equipment, which allows you to make up to 10 million soldering points per day.
Production capacity
The equipment allows you to mount components in size 0201:
- HAKKO, ERSA, Fineplacer Core high-speed installers for installing components of size 0201 and microcircuits with 0.3mm pitch, as well as components of size 0402 and microcircuits with 0.4mm pitch;
- wave conveyor line wave soldering furnace;
- PCB washing system (ultrasound, sparging, washing in deionized water), automatic jet washing;
- x-ray control of each soldered chip ;
- Printers for automatic application of paste MPM 125, ASKA-GP, DESЕN 1008 for applying paste to areas up to 0.3 mm.
- lead-free PCB assembly.
Types of installation
- installation of lead components;
- mounting BGA enclosures (mBGA);
- technology installation COB (Chip-on-Board);
- installation of cases with a step of 0.3 mm.
